I plan to simulate the diffusion bonding of Cu–Ag interface using the
MD approach.
Would you please tell me is LAMMPS capable for this kind of simulation?
Thank you!
I plan to simulate the diffusion bonding of Cu–Ag interface using the
MD approach.
Would you please tell me is LAMMPS capable for this kind of simulation?
probably yes.
the best way to find out is to study the available literature for
similar simulations, look up what features (potentials, system size,
special treatment of the system) are used and compare this with the
potentials and features available in LAMMPS as listed in the on-line
documentation. then you can probably answer the question yourself, or
can come back and ask questions about specific details.
axel.
The biggest problem is that diffusion-bonding is typically quite a
slow process. Even if you heat the system up close to melting, you
may not see much happening on the nanosecond timescale that is
accessible to MD.