Help with ion sputtering issues

I want to use LAMMPS to simulate argon ion sputtering of silicon nitride. When using the fix deposit command, the argon ions output by OVITO dont move to surface. I am not sure if there is an issue with my input code. Below is my in file code. Thank you very much.

units metal
dimension 3
boundary p p f
atom_style atomic
neighbor 2.0 bin
thermo_modify lost warn

read_data si-si3n4-large2.data

minimize 1.0e-4 1.0e-6 1000 10000

change_box all z final 0.0 100.0 units box

mass 1 28.0855
mass 2 14.0067
mass 3 39.948

pair_style hybrid tersoff zbl 1.0 2.0
pair_coeff * * tersoff SiN.Tersoff Si N NULL
pair_coeff 1 3 zbl 14 18
pair_coeff 2 3 zbl 7 18
pair_coeff 3 3 zbl 18 18

region si3n4 block INF INF INF INF 24.875 31
group si3n4 region si3n4
region bottom block INF INF INF INF 2.099 6.134
group bottom region bottom
region thermostat block INF INF INF INF 6.134 20
group thermostat region thermostat
group ar type 3
group mobile subtract all bottom

fix 1 bottom setforce 0.0 0.0 0.0

velocity all create 300.0 12345 dist gaussian
fix nvt_temp mobile nvt temp 300.0 300.0 0.1
run 2000
unfix nvt_temp
fix 2 si3n4 nve
fix 3 thermostat nve
fix 4 thermostat langevin 300.0 300.0 0.5 12345
run 1000

region deposit block 0 106.974 0 89.0564 45 50
fix 5 ar deposit 10 3 50 12345 region deposit near 1.0 vz -1500 -1500
region slab block 0 106.974 0 89.0564 55 60 units box
group addatoms region slab
fix 6 addatoms wall/reflect zhi EDGE

timestep 0.0001

thermo 100
thermo_style custom step temp ke pe atoms
dump 1 all atom 100 dump.sputter.lammpstrj
dump_modify 1 sort id
compute 1 all pe/atom
compute 2 all ke/atom

run 50000

Hello,
Please format your input, its unreadable. Also, only English should be used on here, and some rules have to be followed, see the guidelines.

Best,
Simon

ok

Where is the time integration fix for the deposited atoms?