Title: Lost atoms during NPH step in metal additive manufacturing MD simulation
Description:
I am trying to reproduce the multi-layer deposition methodology from this paper:
Singh et al., “Understanding defect structures in nanoscale metal additive manufacturing via molecular dynamics”, Computational Materials Science 200 (2021) 110807
System details:
Software: LAMMPS 11 Feb 2026
Potential: EAM — Cu_u3.eam (Zhou et al. 2004)
System size: 16a x 16a x 32a copper = 32768 atoms
Substrate temperature: 300K
Liquid temperature: 1500K
Boundary: p p p with 50A vacuum
What I am doing:
1. Equilibrate solid substrate at 300K (NPT)
2. Create pre-equilibrated liquid box at 1500K
3. Place liquid on top of solid with 5A gap
4. Fix solid atoms, heat liquid to 1500K (NVT)
5. Unfix solid
6. Run NPH iso 5ps (paper methodology)
7. NPT cooling 300K
Problem: Every time I run the NPH step I get:
ERROR: Lost atoms: original 65536 current 65534
What I have tried:
-
Different vacuum sizes (30A, 50A, 100A)
-
NPH with drag coefficient (drag 2.0)
-
Smaller timestep during NPH (0.001 ps)
-
z-only pressure control (nph z)
-
Gradual heating of liquid in stages
-
Energy minimization before dynamics
Important observation: Small system (8a x 8a x 16a = 7631 atoms) works perfectly with 91.6% FCC. Full system (65536 atoms) always fails at NPH.
My LAMMPS script for Layer 1:
lammps
# Freeze solid
fix fr1 solid setforce 0.0 0.0 0.0
velocity solid create 300 55555
# Heat liquid gradually
velocity liquid create 500 11111
fix nvt1 liquid nvt temp 500 1500 0.1
run 7500
unfix nvt1
# Equilibrate liquid
fix nvt2 liquid nvt temp 1500 1500 0.1
run 5000
unfix nvt2
# Unfix solid
unfix fr1
# NPH step — THIS IS WHERE IT FAILS
fix nph1 all nph iso 0.0 0.0 1.0 drag 2.0
run 2500
unfix nph1
Question: How should I correctly implement the NPH interaction step for large liquid-solid systems without losing atoms? Is there a specific way to handle the pressure coupling when liquid at 1500K meets solid at 300K?
Any help is greatly appreciated!