I am currently examining the thermo physical characteristics of Copper/Nickel thin film under temperature gradient but i’m having difficulties with the script to use for the deposition of the Nickel atoms to the Copper substrate. The simulation should consists of 16000 copper atoms as the substrate. could you please suggest a script to use for the deposition?
Thanks and Regards,
Ed Michael Joil D. Fajardo
Mindanao State University
Physics Department